Buffing Pads * | Koch-Chemie Kcx Micro Cut Pad

High-Quality Special Sponge For Removing Fine Scratches, Holograms And Polishing Marks Using The Micro Cut M3.02 And Micro Cut & Finish P3.01. The Short Height Of 23Mm Creates Low Torsion Forces, Very Good Handling And The Highest Level Of Stability. The Special Density Of The Foam Material Enables Long-Lasting Compression Hardness During Polishing. The Optimised Reticulation (Open Cellular Structure) And Cell Count Contribute To A High-Shine Finish And Very Good Hygiene Factors. The Milling Edge Ensures Extra Flexibility For The Pads, Enabling Them To Fit Around Contours Easier. The Colourful Non-Woven Material, Suitable For Polishing, Ensures Process Safety.
Compression Hardness: 10. Abrasiveness: 5.